Staff Packaging Engineer

**Requisitos**:
B.S in Physics, Material Science, Chemical or Mechanical Engineering.
Advanced English Level.
5+ years of experience.
Knowledge of semiconductor and acoustic materials including Si, LiTaO3, LiNbO3, GaAs, and others.
Expertise in one or multiple DPS processes including mechanical dicing, stealth dicing, plasma dicing, laser grooving, dice before backgrind, die to tape, and advanced automated inspection techniques preferred.
Experience with advanced SMT flip chip assembly.