Package Failure Analysis Engineer

Package Failure Analysis Engineer
Empresa:

Intel


Detalles de la oferta

At Intel, we create world-changing technology that enriches the lives of every person on earth.

**As a Package Failure Analysis Engineer the primary responsibilities will include, but are not limited to**:

- Responsible for identifying and researching component failures to improve product yield, quality and/or reliability.
- Evaluates the electrical and mechanical characteristics of integrated circuits, components, subcomponents, and systems to determine the root cause of failure.
- Analyzes failure reports and recommends corrective action to prevent reoccurrence of problems.
- Uses all standard electronic test equipment (digital/analog) such as Logic analyzer, ICE, ITPO oscilloscope and test systems to do board failure analysis and debug.
- May support new product transfer and startup and the automation and improvement of the failure analysis process.
- Strives to proliferate shared learning across sites.
- Maintain necessary records and reports.
- Performs other related duties as required or as directed.
- Skills to work effectively in multitasking environments in cross-functional and cross-cultural teams.
- Strong problem solving and communication skills.

**Qualifications**:
Minimum qualifications are required to be initially considered for this position.
- Bachelor's degree in electrical/ Mechanical / Electromechanical / Material Science / Electronic / Chemical Engineering or related field.
- 1+ Year Experience in use of Failure Analysis Tools in the electronic components industry (such as Logic analyzer, ICE, ITPO oscilloscope and test systems to do board failure analysis and debug, among other).
- Flexibility on schedule is provided to accommodate to off regular hours' meetings, if required.
- Intermediate to Advanced English Level.
- Must have Costa Rican Work Permit.

**Inside this Business Group**:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.

**Posting Statement**:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

**Benefits**:
**Working Model**:
This role will require an on-site presence.

JobType

On-site Required


Fuente: Whatjobs_Ppc

Requisitos

Package Failure Analysis Engineer
Empresa:

Intel


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